view boards/mv-sniffer/src/MCL @ 4:b275c69c1b80

doc: describe proposed FPGA design
author Mychaela Falconia <falcon@freecalypso.org>
date Sat, 29 Jul 2023 07:06:54 +0000
parents 0c321f1ce085
children
line wrap: on
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part cap-0603-100n:
 value=100n
 footprint=0603
 description=Ceramic chip capacitor, X7R, 0.1 uF, 0603
 manufacturer=Samsung Electro-Mechanics
 manufacturer_part_number=CL10B104KB8NNWC
 vendor=Digi-Key
 vendor_part_number=1276-1935-1-ND
 npins=2

C1:
 hier=C1
 part=cap-0603-100n

C2:
 hier=C2
 part=cap-0603-100n

part header-6pin:
 footprint=JUMPER6
 description=Header, 0.100", single row, 6 posts
 manufacturer=Molex
 manufacturer_part_number=0901200926
 vendor=Digi-Key
 vendor_part_number=WM14728-ND
 npins=6

J1:
 hier=hdr_sim
 part=header-6pin

J2:
 hier=hdr_fpga
 part=header-6pin

part res-0603-47k:
 value=47k
 footprint=0603
 description=Chip resistor, 47 kOhm, 0603
 manufacturer=Yageo
 manufacturer_part_number=RC0603FR-1347KL
 vendor=Digi-Key
 vendor_part_number=13-RC0603FR-1347KLCT-ND
 npins=2

R1:
 hier=R1
 part=res-0603-47k

R2:
 hier=R2
 part=res-0603-47k

R3:
 hier=R3
 part=res-0603-47k

U1:
 hier=buffer.pkg
 device=74LVC4T3144
 footprint=TSSOP14_MNF
 manufacturer=Nexperia
 manufacturer_part_number=74LVC4T3144PWJ
 description=Dual supply buffer IC, TSSOP14
 vendor=Digi-Key
 vendor_part_number=1727-7424-1-ND
 npins=14