view gsm-fw/Makefile @ 923:10b4bed10192

gsm-fw/L1: fix for the DSP patch corruption bug The L1 code we got from the LoCosto fw contains a feature for DSP CPU load measurement. This feature is a LoCosto-ism, i.e., not applicable to earlier DBB chips (Calypso) with their respective earlier DSP ROMs. Most of the code dealing with that feature is conditionalized as #if (DSP >= 38), but one spot was missed, and the MCU code was writing into an API word dealing with this feature. In TCS211 this DSP API word happens to be used by the DSP code patch, hence that write was corrupting the patched DSP code.
author Mychaela Falconia <falcon@ivan.Harhan.ORG>
date Mon, 19 Oct 2015 17:13:56 +0000
parents f5affe83ba2d
children
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SUBDIR=	L1 bsp ccd comlib finlink g23m-aci g23m-glue g23m-gsm gpf include \
	libiram lldbg nucleus riviera serial services sprintf sysglue

default:	config.stamp
	${MAKE} ${MFLAGS} -f Makefile.build $@

ramImage flashImage:	config.stamp
	${MAKE} ${MFLAGS} -f Makefile.build $@

config.stamp:	build.conf
	cfgmagic/processconf.sh
	touch $@

build.conf:
	@echo 'Configuration is required before the build.'
	@echo 'Please copy one of the configuration files under configs/'
	@echo 'to build.conf, optionally edit it to taste, and then run make.'
	@false

clean: FRC
	rm -f a.out core errs *.stamp
	for i in ${SUBDIR}; do (cd $$i; ${MAKE} ${MFLAGS} clean); done

FRC: